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Metallurgy Materials Science and Engineering Laboratory

By Handwerker, Carol A.

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Book Id: WPLBN0000697144
Format Type: PDF eBook:
File Size: 0.7 MB
Reproduction Date: 2005

Title: Metallurgy Materials Science and Engineering Laboratory  
Author: Handwerker, Carol A.
Volume:
Language: English
Subject: Technology., Reference materials, Technology and literature
Collections: Techonology eBook Collection
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A. Handwerke, B. C. (n.d.). Metallurgy Materials Science and Engineering Laboratory. Retrieved from http://www.gutenberg.us/


Description
Technical Reference Publication

Excerpt
Introduction: This report describes the major technical activities and accomplishments of the Metallurgy Division in 1997, and, therefore, reflects the research priorities established after extensive consultation and collaboration with our customers in US industry. It also reflects the Program planning and management structure that we have developed within the Materials Science and Engineering Laboratory (MSEL) to meet the identified needs of the Nation?s measurement and standards infrastructure. The Division is organized administratively into groups that represent the Division?s core expertise in Metallurgical Processing, Electrochemical Processing, Magnetic Materials, Materials Structure and Characterization, and Materials Performance. However, by virtue of the interdisciplinary nature of materials science and engineering, the Program teams cut across the Division?s management groups and, in many cases, cut across MSEL Divisions and the NIST Laboratories in order to best meet the scientific and technical.

Table of Contents
TABLE OF CONTENTS Page INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 ELECTRONIC PACKAGING, INTERCONNECTION AND ASSEMBLY . . . . . . . . . . . . . 7 Lead-Free Solders . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 High-Temperature Solders for Microelectronics . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Solderability Measurements for Microelectronics . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Solder Interconnect Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Stress Measurements in Electronic Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Solder Jet Printing for Microelectronics Applications . . . . . . . . . . . . . . . . . . . . . . . . 18 INTELLIGENT PROCESSING OF MATERIALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Solidification Path Modeling for Casting of Multicomponent Aerospace Alloys . . . . . . 22 Generation of Grain Defects Near Corners and Edges in Castings . . . . . . . . . . . . . . . 24 Porosity in Castings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Thermophysical Data for Castings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Magnetics for Steel Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 MAGNETIC MATERIALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Giant Magnetoresistance Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Processing and Micromagnetics of Thin Magnetic Films . . . . . . . . . . . . . . . . . . . . . 39 Magnetic Properties of Nanomaterials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 METALS DATA AND CHARACTERIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Thermophysical Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Microstructural Studies of Complex Phases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Mechanical and Thermal Properties of Multilayered Materials . . . . . . . . . . . . . . . . . . 54 Hardness Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Magnetic Properties and Standard Reference Materials . . . . . . . . . . . . . . . . . . . . . . . 62 Lightweight Materials for Automotive Applications . . . . . . . . . . . . . . . . . . . . . . . . . 63 Performance of Structural Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Performance of Materials in Corrosive Media . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Magneto-Optical Imaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Development of Scanning Acoustic Microscopy . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Electron Microscopy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 METALS PROCESSING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 Processing of Advanced Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 Solidification Modeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 iv

 
 



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